Apparatus for power management

ABSTRACT

Apparatus include an array of memory cells, a controller to perform access operations on the array of memory cells, a clock signal node, a counter having an input selectively connected to the clock signal node, and a clock generator having an output connected to the input of the counter.

RELATED APPLICATIONS

This Application is a continuation of U.S. patent application Ser. No.15/054,409, titled “POWER MANAGEMENT,” filed Feb. 26, 2016, (allowed),which is a continuation of U.S. patent application Ser. No. 14/182,719,titled “POWER MANAGEMENT,” filed Feb. 18, 2014, and issued as U.S. Pat.No. 9,293,176 on Mar. 22, 2016, which are commonly assigned andincorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates generally to memory and, in particular,in one or more embodiments, the present disclosure relates to apparatusutilizing a counter in power management.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuit devices in computers or other electronic devices.There are many different types of memory including random-access memory(RAM), read only memory (ROM), dynamic random access memory (DRAM),synchronous dynamic random access memory (SDRAM), and flash memory.

Flash memory devices have developed into a popular source ofnon-volatile memory for a wide range of electronic applications. Flashmemory devices typically use a one-transistor memory cell that allowsfor high memory densities, high reliability, and low power consumption.Changes in threshold voltage of the memory cells, through programming(which is often referred to as writing) of charge storage structures(e.g., floating gates or charge traps) or other physical phenomena(e.g., phase change or polarization), determine the data value of eachcell. Common uses for flash memory include personal computers, personaldigital assistants (PDAs), digital cameras, digital media players,cellular telephones, solid state drives and removable memory modules,and the uses are growing.

Power consumption is often an important consideration in the design andusage of memory devices. Problems may arise when multiple memory devicesare operated concurrently. Such problems could include exceeding powerconsumption specifications and/or availability.

For the reasons stated above, and for other reasons stated below whichwill become apparent to those skilled in the art upon reading andunderstanding the present specification, there is a need in the art foralternative methods of managing power, and apparatus to perform suchmethods.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified block diagram of a memory device in communicationwith a processor as part of an electronic system, according to anembodiment.

FIG. 2 is a simplified block diagram of a memory module in communicationwith a host as part of an electronic system, according to anotherembodiment.

FIG. 3 is a perspective view of a representation of a multi-die packageaccording to an embodiment.

FIG. 4a is a schematic representation of a multi-die package accordingto an embodiment.

FIG. 4b is a schematic representation of a multi-die package accordingto another embodiment.

FIG. 5 is a representation of a time-line of an access operation showingdesignated points for pausing the access operation according to anembodiment.

FIG. 6 is one example of a timing diagram showing operation of amulti-die package of the type depicted in FIG. 4a or 4 b according to anembodiment.

FIG. 7 is another example of a timing diagram showing operation of amulti-die package of the type depicted in FIG. 4a or 4 b according to anembodiment.

FIG. 8a is a simplified schematic of a circuit for generating a highcurrent indication signal for a multi-die package of the type depictedin FIG. 4a according to an embodiment.

FIG. 8b is a simplified schematic of a circuit for generating a highcurrent indication signal for a multi-die package of the type depictedin FIG. 4b according to an embodiment.

FIG. 9 is a simplified schematic of a circuit for generating aready/busy control signal for the type of multi-die packages depicted inFIG. 4a or 4 b according to an embodiment.

FIG. 10a is a simplified schematic of a circuit for generating aninternal clock signal and a count of a wrap-around counter according toan embodiment.

FIG. 10b is a simplified schematic of a circuit for generating aninternal clock signal and a count of a wrap-around counter according toanother embodiment.

FIG. 11 is a schematic representation of a multi-die package accordingto an embodiment.

FIG. 12 is a schematic representation of a multi-die package accordingto another embodiment.

FIG. 13 is a timing diagram showing conceptually how particular diesmight be designated to provide their respective clock signals for amulti-die package of the type depicted in FIG. 11 or 12 according to anembodiment.

FIG. 14 is a simplified block diagram of a of an electronic systemhaving multiple channels according to another embodiment.

FIG. 15 is a flowchart of a method of operating a plurality of diesaccording to an embodiment.

FIG. 16 is a schematic of a wrap-around counter according to anembodiment.

FIG. 17 depicts waveforms for the wrap-around counter of FIG. 16.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings that form a part hereof, and in which is shown, byway of illustration, specific embodiments. In the drawings, likereference numerals describe substantially similar components throughoutthe several views. Other embodiments may be utilized and structural,logical and electrical changes may be made without departing from thescope of the present disclosure. The following detailed description is,therefore, not to be taken in a limiting sense.

Memory device access operations (e.g., write operations, read operationsor erase operations) have varying current, and thus power, demandsthroughout the operations. Allowing multiple memory devices of anelectronic system to proceed with access operations concurrently canexceed power availability, such as when too many devices are performingaccess operations.

A variety of techniques have been utilized to manage power consumptionof memory systems containing multiple memory devices (e.g., dies,modules and/or packages), many of which rely on a memory controller tostagger the activity of the memory devices seeking to avoid performinghigh power portions of access operations concurrently in more than onememory device. Several of these techniques are discussed in U.S.Provisional Patent Application Ser. No. 61/749,768 (see, e.g., pages12-17).

Various embodiments described herein facilitate power management amongmultiple apparatus. In multi-die operations with peak power management,each die may be given an opportunity to be able to participate in asequence of operations, where more than one die may be permitted toexperience portions of their respective operations deemed to be of highcurrent demand (as used herein, a “portion of an operation” can, in someembodiments, include the entire operation). In various embodiments, onedie of a multi-die package can provide (e.g., generate) a clock formaintaining a die priority order between multiple dies, and the otherdies can share this clock. A high current indication signal can beshared between these dies to indicate whether any of the dies isexperiencing (e.g., is about to enter or is in) a high current demandportion of an operation. The high current indication signal may also beused to provide, in conjunction with the clock, an indication of amagnitude of a current expected to be consumed by the die during thehigh current demand portion of the operation (e.g., a relative unitmagnitude).

FIG. 1 is a simplified block diagram of a first apparatus, in the formof a memory device 100, in communication with a second apparatus, in theform of a processor 130, as part of a third apparatus, in the form of anelectronic system, according to an embodiment. Some examples ofelectronic systems include personal computers, personal digitalassistants (PDAs), digital cameras, digital media players, digitalrecorders, games, appliances, vehicles, wireless devices, cellulartelephones and the like. The processor 130, e.g., a controller externalto the memory device 100, may be a memory controller or other externalhost device.

Memory device 100 includes an array of memory cells 104 logicallyarranged in rows and columns. Memory cells of a logical row aretypically coupled to the same access line (commonly referred to as aword line) while memory cells of a logical column are typicallyselectively coupled to the same data line (commonly referred to as a bitline). A single access line may be associated with more than one logicalrow of memory cells and a single data line may be associated with morethan one logical column. Memory cells (not shown in FIG. 1) of at leasta portion of array of memory cells 104 are capable of being programmedto one of at least two data states.

A row decode circuitry 108 and a column decode circuitry 110 areprovided to decode address signals. Address signals are received anddecoded to access the array of memory cells 104. Memory device 100 alsoincludes input/output (I/O) control circuitry 112 to manage input ofcommands, addresses and data to the memory device 100 as well as outputof data and status information from the memory device 100. An addressregister 114 is in communication with I/O control circuitry 112 and rowdecode circuitry 108 and column decode circuitry 110 to latch theaddress signals prior to decoding. A command register 124 is incommunication with I/O control circuitry 112 and control logic 116 tolatch incoming commands.

An internal controller (e.g., control logic 116) controls access to thearray of memory cells 104 in response to the commands and generatesstatus information for the external processor 130, i.e., control logic116 is configured to perform access operations. The control logic 116 isin communication with row decode circuitry 108 and column decodecircuitry 110 to control the row decode circuitry 108 and column decodecircuitry 110 in response to the addresses.

Control logic 116 is also in communication with a cache register 118.Cache register 118 latches data, either incoming or outgoing, asdirected by control logic 116 to temporarily store data while the arrayof memory cells 104 is busy writing or reading, respectively, otherdata. During a write operation (e.g., program operation), data is passedfrom the cache register 118 to data register 120 for transfer to thearray of memory cells 104; then new data is latched in the cacheregister 118 from the I/O control circuitry 112. During a readoperation, data is passed from the cache register 118 to the I/O controlcircuitry 112 for output to the external processor 130; then new data ispassed from the data register 120 to the cache register 118. A statusregister 122 is in communication with I/O control circuitry 112 andcontrol logic 116 to latch the status information for output to theprocessor 130.

Memory device 100 receives control signals at control logic 116 fromprocessor 130 over a control link 132. The control signals may includeat least a chip enable CE#, a command latch enable CLE, an address latchenable ALE, and a write enable WE#. Additional control signals (notshown) may be further received over control link 132 depending upon thenature of the memory device 100. Memory device 100 receives commandsignals (which represent commands), address signals (which representaddresses), and data signals (which represent data) from processor 130over a multiplexed input/output (I/O) bus 134 and outputs data toprocessor 130 over I/O bus 134.

For example, the commands are received over input/output (I/O) pins[7:0] of I/O bus 134 at I/O control circuitry 112 and are written intocommand register 124. The addresses are received over input/output (I/O)pins [7:0] of bus 134 at I/O control circuitry 112 and are written intoaddress register 114. The data are received over input/output (I/O) pins[7:0] for an 8-bit device or input/output (I/O) pins [15:0] for a 16-bitdevice at I/O control circuitry 112 and are written into cache register118. The data are subsequently written into data register 120 forprogramming the array of memory cells 104. For another embodiment, cacheregister 118 may be omitted, and the data are written directly into dataregister 120. Data are also output over input/output (I/O) pins [7:0]for an 8-bit device or input/output (I/O) pins [15:0] for a 16-bitdevice.

It will be appreciated by those skilled in the art that additionalcircuitry and signals can be provided, and that the memory device ofFIG. 1 has been simplified. It should be recognized that thefunctionality of the various block components described with referenceto FIG. 1 may not necessarily be segregated to distinct components orcomponent portions of an integrated circuit device. For example, asingle component or component portion of an integrated circuit devicecould be adapted to perform the functionality of more than one blockcomponent of FIG. 1. Alternatively, one or more components or componentportions of an integrated circuit device could be combined to performthe functionality of a single block component of FIG. 1.

Additionally, while specific I/O pins are described in accordance withpopular conventions for receipt and output of the various signals, it isnoted that other combinations or numbers of I/O pins may be used in thevarious embodiments.

A given processor 130 may be in communication with one or more memorydevices 100, e.g., dies. FIG. 2 is a simplified block diagram of anapparatus in the form of a memory module 201 in communication with ahost 240 as part of an electronic system, according to anotherembodiment. Memory devices 100 and processor 130 may be as describedwith reference to FIG. 1. Although memory module (e.g., package) 201 isdepicted with four memory devices 100 (e.g., dies), memory module couldhave one or more memory devices 100.

Because processor 130 (e.g., a memory controller) is between the host240 and the memory devices 100, communication between the host 240 andthe processor 130 may involve different communication links than thoseused between the processor 130 and the memory devices 100. For example,the memory module 201 may be an Embedded MultiMediaCard (eMMC) of asolid state drive (SSD). In accordance with existing standards,communication with an eMMC may include a data link 242 for transfer ofdata (e.g., an 8-bit link), a command link 244 for transfer of commandsand device initialization, and a clock link 246 providing a clock signalfor synchronizing the transfers on the data link 242 and command link244. The processor 130 may handle many activities autonomously, such aserror correction, management of defective blocks, wear leveling andaddress translation.

FIG. 3 is a perspective view of a representation of a multi-die package302 according to an embodiment. Multi-die package 302 is depicted toinclude four dies 100 (i.e., 100 ₀-100 ₃ corresponding to Die0-Die3),although multi-die packages could have fewer or more such dies. Each ofthe dies 100, as well as the package 302, may include a node 304 (e.g.,a pad) for providing a ready/busy control signal RB#. The ready/busycontrol signal may be used to indicate to a host device or to the dies100 in the multi-die package 302 whether one or more of the dies 100 arebusy performing an operation. As such, the ready/busy control signalnodes 304 may be commonly connected. Each of the dies 100, as well asthe package 302, may include a node 306 for providing input/output (I/O)signals. Note that each node 306 may represent more than one physicalnode, e.g., one pad for each signal of the I/O bus 134 of FIG. 1 foreach of the dies 100 and the multi-package 302. The nodes 306 may becommonly connected. Each of the dies 100, as well as the package 302,may include a node 308 for providing control signals. Note that eachnode 308 may represent more than one physical node, e.g., one pad foreach signal of the control link 132 of FIG. 1 for each of the dies 100and the multi-package 302. The nodes 308 may be commonly connected. Eachof the dies 100, as well as the package 302, may include a node 310(e.g., a pad) for providing a chip enable signal CE#. The chip enablesignal may be used to enable access to the dies 100 in the multi-diepackage 302. As such, the nodes 310 may be commonly connected. Each ofthe dies 100, as well as the package 302, may include a node 312 forproviding a high current indication signal HC#. The high currentindication signal HC# may be shared between the dies 100 and with a hostdevice to indicate when one of the dies 100 is experiencing a highcurrent demand portion of an operation. In conjunction with secondaryclock cycles of the internal clock signal ICLK, as described in moredetail later, the high current indication signal HC# can provide anindication of high current demand to other devices sharing the internalclock signal ICLK. The nodes 312 may be commonly connected, but noconnection to the multi-die package is needed. Each of the dies 100 mayinclude a node 314 for providing an internal clock signal ICLK. Theclock signal may be shared between the dies 100. Use of the clock signalwill be described with reference to subsequent figures. The nodes 314may be commonly connected among the dies 100, but no connection to themulti-die package is needed.

FIG. 4a is a schematic representation of the multi-die package 302including four dies 100 (e.g., 100 ₀-100 ₃) according to an embodiment.The clock signal ICLK is commonly shared between the dies 100 through aclock signal node (e.g., line) 422. The high current indication signalHC# is commonly shared between the dies 100 through a high currentindication signal node (e.g., line) 424. The high current indicationsignal HC# may be normally pulled to a particular state (e.g., pulledhigh), such as by connecting the high current indication signal node 424to a voltage supply node 414, coupled to receive a supply voltage suchas Vcc, through a resistor 416, sometimes collectively referred to as aweak pull-up resistor, or simply a pull-up resistor.

The ready/busy control signal RB# is commonly shared between the dies100 through a ready/busy control signal node (e.g., line) 426. Theready/busy control signal RB# may be normally pulled to a particularstate (e.g., pulled high), such as by connecting the ready/busy controlsignal node 426 to a voltage supply node 418 through a resistor 420.Each of the dies 100 is further commonly connected to a control link 132and to an I/O bus 134.

FIG. 4b is a schematic representation of the multi-die package 302including four dies 100 (e.g., 100 ₀-100 ₃) according to an embodiment.The multi-die package 302 of FIG. 4b differs from the multi-die packageof FIG. 4a in that neither the high current indication signal node 424nor the ready/busy control signal node 426 are depicted to be connectedto a pull-up resistor. Such a configuration might be used where it isdesired to not rely on an external pull-up resistor for the high currentindication signal node 424 or the ready/busy control signal node 426.

Peak power management as described herein might be utilized, forexample, during write operations, read operations and erase operations,where periods of high current demand may be common. For example,precharging access lines for an access operation, e.g., a writeoperation or a read operation, may be deemed a high current demandportion of the access operation. Other access operations may alsobenefit from such peak power management. As used herein, a high currentdoes not refer to any particular current level. Instead, the term “highcurrent demand portion of an operation” may refer to a portion (e.g.,period) of an operation of a device where it is desired, during thatportion, to restrict current usage of other devices commonly sharing theclock signal ICLK.

Various embodiments facilitate having more than one die experiencinghigh current demand portions of their operations concurrently if aparticular unit limit is not exceeded. The unit limit might simply be amaximum number of dies permitted to concurrently experience high currentdemand portions of their operations, or it might incorporate somerelative or quantitative magnitude of expected current consumption. Asone example, a multi-die package may be configured to permit only twodies to concurrently experience high current demand portions of theiroperations. As another example, the unit limit might take into accountdiffering current demand for similar operations between different dies.For example, if Die3 was expected to use more current for accessoperations than Die2, Die2 was expected to use more current for accessoperations than Die1, and Die1 was expected to use similar current foraccess operations as Die0, Die3 might be assigned three units when itenters a period of high current demand, Die2 might be assigned two unitswhen it enters a period of high current demand, and Die1 and Die0 mighteach be assigned one unit when they enter periods of high currentdemand. In this example, if the unit limit were four units, Die0, Die1and Die2 would be permitted to be within periods of high current demandconcurrently, but Die3 and Die2 would not be permitted to be withinperiods of high current demand concurrently. This unit assignment foreach die may further take into consideration a quantitative magnitude ofcurrent demand difference, rather than merely a relative magnitude ofcurrent demand difference. For example, if Die3 were expected to use 20%more current than Die0, Die3 might be assigned 1.2 units for each unitassigned to Die0 (e.g., a unit multiplier of 1.2) to more closelyprovide a quantitative indication of expected current consumption. Eachdie sharing the internal clock signal ICLK may store the unitassignments for all such dies as well as the unit limit, such as withintheir respective arrays of memory cells, or some other storage areawithin each respective die, such as a volatile or nonvolatile register.It is noted that while unit consumption of current may be related to anexpected level of current usage, it may not be proportional to actualcurrent usage. In fact, while unit assignments might be assigned basedon expected operating characteristics, changes in environmentalconditions or deterioration of a device, for example, may alter itsactual current demand from those expectations.

While the internal clock signal ICLK is active, each die sharing theinternal clock signal ICLK can monitor unit consumption of currentacross the dies sharing the internal clock signal ICLK. A counter (e.g.,a wrap-around counter) can generate a series of counter values, such asvalues corresponding to (e.g., assigned to) each die sharing theinternal clock signal ICLK, then repeat the series. For example, ifthere are N dies sharing the internal clock signal ICLK, the wrap-aroundcounter may iteratively count from 0 to N−1. When a count value of thewrap-around counter matches a counter value assigned to a die, thecorresponding die may indicate to other dies whether it is experiencing(e.g., is about to enter or is presenting performing) a portion of anaccess operation deemed to be of high current demand, presuming that theaccess operation is paused and waiting for an indication that it mayresume. The indication may further include an indication of magnitude ofcurrent that the die is expected to consume (e.g., the relative amountor quantity of current the die is about to consume or is presentlyconsuming). For embodiments assigning different units to different dies,each die may determine (e.g., track) which other die provided such anindication in order to add the appropriate unit to a tally of total unitconsumption. This is made possible as each die will know the value ofthe wrap-around counter at the time the indication was received.

Each die can pause its access operations at designated points (e.g.,prior to entering a period of high current demand) until a value of awrap-around counter matches a counter value assigned to that die. Whenthe counter values match, if the die is presently waiting to enter aperiod of high current demand, the die can compare the total unitconsumption of current that it has determined (e.g., tallied) from thedies sharing the internal clock signal ICLK. If the total unitconsumption is less than or equal to the unit limit, the die can enterits period of high current demand by resuming the access operation, andcan indicate to other dies that it has done so. The total unitconsumption compared to the unit limit may include the expectedconsumption of the die making the comparison, such that this die willonly enter its period of high current demand if doing so would notexceed the unit limit. Alternatively, the total unit consumption maydisregard the expected consumption of the die making the comparison,such that this die will enter its period of high current demand if thetotal unit consumption of the remaining dies does not exceed the unitlimit. Regardless of whether the die was waiting to enter a period ofhigh current demand, the die can reset its tally of total unitconsumption, e.g., prior to, or in response to, the next count of thewrap-around counter or the next cycle of the internal clock signal ICLK.Note that if each die resets its tally of total unit consumption, eachdie may have a different value for the total unit consumption. However,each die may make its own determination based on the total unitconsumption it has determined at the time the value of the wrap-aroundcounter matches the counter value assigned to that die.

FIG. 5 is a representation of a time-line 540 of an access operationshowing designated points 546 (e.g., 546 a and 546 b) for pausing theaccess operation according to an embodiment. The time-line 540 mightrepresent an access operation proceeding from an initiation at 542 untila completion at 544. The access operation may have one or moredesignated points 546 (e.g., 546 a and 546 b) where the access operationwill pause and wait for an indication that it can resume the accessoperation as described above. The designated points 546 may representparticular steps of an algorithm (e.g., such as might be executed by aninternal controller of the die) for performing the access operation thatprecede portions of the access operation that are deemed to be of highcurrent demand. For example, the access operation may begin at 542 andproceed until it reaches designated point 546 a. At designated point 546a, the access operation may pause and wait until the value of thewrap-around counter matches a counter value assigned to the dieperforming the access operation, and the total unit consumption is lessthan or equal to the unit limit. At that point the access operation mayresume, where it may proceed until it reaches designated point 546 b. Atdesignated point 546 b, the access operation may again pause and waituntil the value of the wrap-around counter matches a counter valueassigned to the die performing the access operation, and the total unitconsumption is less than or equal to the unit limit. At that point theaccess operation may resume, where it may proceed until it reachescompletion at 544.

It is noted that there may be situations where a particular die will notreach a condition where the value of the wrap-around counter matches acounter value assigned to the particular die and the total unitconsumption determined by the particular die is less than or equal tothe unit limit, such that it may be stalled for an unacceptable amountof time. To mitigate such situations, each die may further include atime-out timer, such that if the die has been waiting for a particularamount of time, it may provide the indication that it is entering itsperiod of high current demand, but not actually enter the period of highcurrent demand. By indicating the die is experiencing a high currentdemand portion of an operation without the die actually experiencing ahigh current demand portion of an operation, the unit limit will not beexceeded, and an opportunity will eventually be opened for the die toproceed as other die might only proceed with new periods of high currentdemand if they can be initiated in view of the determination of unitconsumption for the die that has timed out.

FIG. 6 is one example of a timing diagram showing operation of amulti-die package of the type depicted in FIG. 4a or 4 b according to anembodiment. Access operations in each die may pause at one or moredesignated points prior to entering a high current demand portion ofthat access operation as discussed with reference to FIG. 5, and mightcheck if they can enter the high current demand portion only when avalue of a wrap-around counter matches a counter value assigned to eachcorresponding die.

In the example of FIG. 6, and with reference to the dies 100 of FIG. 4aor 4 b, dies 100 ₀/100 ₁/100 ₂/100 ₃ (i.e., Die0/Die1/Die2/Die3) may beassigned the counter values 0/1/2/3, respectively. Each die's countervalue may be assigned by MDS pins or during an assignment step whilesetting features of the die during an initialization of that die.Referring to FIG. 6, at time t1, the ready/busy control signal RB#transitions to a logic low, indicating that at least one of the dies isbusy performing an operation. In response, the internal clock signalICLK may begin. Alternatively, the internal clock signal ICLK may beindependent of the ready/busy control signal RB#, and might be startedin response to a command from an external controller when that externalcontroller seeks to cause one of the dies 100 to perform an accessoperation. A wrap-around counter (described in more detail later)responsive to the internal clock signal ICLK begins counting. As will bedescribed with reference to FIGS. 16 and 17, the wrap-around counterdoes not count each cycle of the internal clock signal ICLK. Instead, aprimary clock cycle (e.g., a first clock cycle) corresponds to a counterincrement, and one or more secondary clock cycles (e.g., subsequentclock cycles) are used to determine (e.g., in conjunction with the highcurrent indication signal HC#) whether a die is deemed to beexperiencing a high current demand portion of an access operation. Inthe example of FIG. 6, every other clock cycle (e.g., every odd clockcycle) of the internal clock signal ICLK corresponds to a counterincrement, and every other clock cycle (e.g., every even clock cycle) ofthe internal clock signal ICLK (e.g., in conjunction with the highcurrent indication signal HC#) provides an indication whether acorresponding die is deemed to be experiencing a high current demandportion of an access operation (i.e., is entering or performing a highcurrent demand portion of an access operation).

The dies of a multi-die package sharing the internal clock signal ICLKwill look to a value of the high current indication signal HC# duringthe secondary clock cycles of the internal clock signal ICLK during acount of the wrap-around counter to determine unit consumption for thedie corresponding to the value of the wrap-around counter. Where theunit limit is a number of dies, each die may simply count the number oftimes the high current indication signal HC# is low during each count ofthe wrap-around counter occurring since the last time the value of thewrap-around counter matched the counter value assigned to thatparticular die. Where each die is assigned a particular unit, each diemay sum the unit assignments for the dies indicating high currentdemand. When the count value of the wrap-around counter matches thecounter value assigned to a particular die, if that die is waiting toenter a period of high current demand, it may compare the number ofunits of consumption it has counted since its previous cycle of thewrap-around counter to a unit limit. If the unit limit is not exceeded,the corresponding die can resume its access operation and enter itsperiod of high current demand. That die would further transition thehigh current indication signal HC# for one or more secondary clockcycles to indicate to other dies that it has done so.

In the example of FIG. 6, dies 100 ₀ and 100 ₂ are not waiting at one oftheir designated points in an access operation prior to entering aperiod of high current demand, so no action is taken regarding the highcurrent indication signal HC# when the count value of the wrap-aroundcounter matches the counter values assigned to those dies. Prior to timet2, die 100 ₁ may reach a designated point in an access operation priorto entering a period of high current demand for that die, and thataccess operation may be paused as a result. For example, an internalcontroller of the die might be configured (e.g., coded) to cause theaccess operation to pause at one or more designated points, and to waitfor a subsequent indication that it can resume. When the wrap-aroundcounter reaches a value corresponding to the counter value assigned todie 100 ₁ at time t2, the controller in die 100 ₁, assuming its accessoperation is paused at one of its designated points waiting to perform ahigh current demand portion, will transition the high current indicationsignal HC# to a logic low. The high current indication signal HC# may beheld low for a subsequent clock cycle of the internal clock signal ICLK,and then released at time t3. Note that release of the high currentindication signal HC# does not indicate that die 100 ₁ has completed itsperiod of high current demand.

Prior to time t4, die 100 ₃ may reach a designated point in an accessoperation prior to entering a period of high current demand for thatdie, and that access operation may be paused as a result. When thewrap-around counter reaches a value corresponding to the counter valueassigned to die 100 ₃ at time t4, the controller in die 100 ₃, assumingits access operation is paused at one of its designated points waitingto perform a high current demand portion, will transition the highcurrent indication signal HC# to a logic low. The high currentindication signal HC# may be held low for a subsequent clock cycle ofthe internal clock signal ICLK, and then released at time t5.

At time t6, die 100 ₁ may either still be within the high current demandportion of its access operation resumed at time t2, or may be waiting atanother designated point prior to entering a period of high currentdemand, either in the same access operation or a subsequent accessoperation. In either case, the controller in die 100 ₁ will transitionthe high current indication signal HC# to a logic low at time t6. Thehigh current indication signal HC# may be held low for a subsequentclock cycle of the internal clock signal ICLK, and then released at timet7. Further at time t8, the ready-busy control signal RB# istransitioned to a logic high, thereby resetting the wrap-around counter.

It is noted that a controller might be configured to cause thetransitions of the ready/busy control signal RB# and the high currentindication signal HC# as described. For example, the controller might beconfigured to cause circuitry of the die to transition the ready/busycontrol signal RB# at the beginning of the access operation, and causeit to be released by the die at the end of the access operation.Similarly, the controller might be configured to cause circuitry of thedie to transition the high current indication signal HC# as indicated.It is further noted that while a controller may cause action within itsrespective die to cause a transition of the ready/busy control signalRB#, the ready/busy control signal RB# may already have the logic levelsought by the controller due to action in some other die sharing theready/busy control signal RB#.

For some embodiments, additional secondary clock cycles of the internalclock signal ICLK might be used to provide an indication of a magnitudeof current expected to be consumed by a particular die. For example, afirst access operation (or portion of that access operation) might bedeemed to have a high level of high current demand, a second accessoperation (or portion of that access operation) might be deemed to havea medium level of high current demand, and a third access operation (orportion of that access operation) might be deemed to have a low level ofhigh current demand. Units might then be assigned to each accessoperation, such as three units when a die enters a high current demandportion of the first access operation, two units when the die enters ahigh current demand portion of the second access operation, and one unitwhen the die enters a high current demand portion of the third accessoperation. If used in conjunction with unit assignments by expecteddifferences in current consumption for similar access operations, theunit assignments per die and access operation might be multiplied, forexample, to reach a unit consumption for a particular die performing aparticular access operation (or portion of that access operation).

FIG. 7 is another example of a timing diagram showing operation of amulti-die package of the type depicted in FIG. 4a or 4 b according to anembodiment. In this example as well, dies 100 ₀/100 ₁/100 ₂/100 ₃ may beassigned the counter values 0/1/2/3, respectively. FIG. 7 depicts anexample where a number of secondary clock cycles of the internal clocksignal ICLK, during which HC# is active (e.g., pulled low), can be usedto indicate a magnitude of expected current consumption. In thisexample, each count 751 of the wrap-around counter corresponds to aprimary clock cycle 752 and a plurality of secondary clock cycles 753.In the example of FIG. 7, there are three secondary clock cycles 753 foreach count 751. Each secondary clock cycle 753 might correspond to oneunit of consumption if the high current indication signal HC# is logiclow. For example, Die1 transitions the high current indication signalHC# to logic low for three secondary clock cycles 753 at time t1 suchthat remaining dies might add three units of consumption to theirtallies of total unit consumption. Die3 transitions the high currentindication signal HC# to logic low for three secondary clock cycles 753at time t2 such that remaining dies might similarly add three units ofconsumption to their tallies of total unit consumption. At time t3, Die1transitions the high current indication signal HC# to logic low for twosecondary clock cycles 753, indicating that Die1 has entered asubsequent high current demand portion of either its present accessoperation or a subsequent access operation, and that subsequent highcurrent demand portion has a lower current demand. Remaining dies mightadd two units of consumption to their tallies of total unit consumptionin this instance. Die2 transitions the high current indication signalHC# to logic low for one secondary clock cycles 753 at time t4 such thatremaining dies might add one unit of consumption to their tallies oftotal unit consumption. In each case, if a die has been assigned a unitmultiplier, the units of consumption indicated by the number ofsecondary clock cycles that the high current indication signal HC# isasserted may be multiplied by the corresponding unit multiplier prior toadding to their tallies of total unit consumption.

FIG. 8a is a simplified schematic of a circuit for generating the highcurrent indication signal HC# for the type of multi-die package depictedin FIG. 4a according to an embodiment. As depicted in FIG. 8a , fourdies 100 ₀-100 ₃ commonly share the high current indication signal HC#via high current indication signal node 424. The high current indicationsignal HC# may be normally pulled to a logic high using voltage supplynode 414 and resistor 416, for example. For each of the dies 100 ₀-100₃, another voltage supply node, such as reference potential node 834coupled to receive a reference potential, such as a ground or Vss, maybe selectively connected to the high current indication signal node 424through a switch, e.g., a transistor 832, each having a control gatecoupled to receive a control signal. For example, die 100 ₀ may have thecontrol gate of its transistor 832 coupled to receive the control signalG0, die 100 ₁ may have the control gate of its transistor 832 coupled toreceive the control signal G1, die 100 ₂ may have the control gate ofits transistor 832 coupled to receive the control signal G2, and die 100₃ may have the control gate of its transistor 832 coupled to receive thecontrol signal G3. These control signals are generated (e.g., by theinternal controllers of the dies) to activate their respectivetransistor 832 when their respective die 100 experiences (e.g., is aboutto enter or has entered) a high current demand portion of an accessoperation, e.g., in response to a value of the wrap-around countermatching a counter value assigned to that die 100 and the total unitconsumption of current determined by that die 100 being less than orequal to the unit limit while an access operation of that die 100 ispaused at one of its designated points. As an example, the controlsignals for the gates of transistors 832 may be normally logic low todeactivate the depicted n-type field-effect transistor (n-FET), and maytransition to a logic high responsive to a die 100 experiencing a periodof high current demand. These control signals may be held at a logichigh for one or more secondary clock cycles of the internal clock signalICLK to provide an indication of a magnitude of the expected currentconsumption for their respective dies 100. As such, when a transistor832 is activated, the voltage level of the high current indicationsignal node 424 will be pulled to a logic low, and the voltage level ofthe high current indication signal node 424 will be pulled back to alogic high when none of the transistors 832 are activated.

FIG. 8b is a simplified schematic of a circuit for generating the highcurrent indication signal HC# for the type of multi-die package depictedin FIG. 4b according to an embodiment. As depicted in FIG. 8b , fourdies 100 ₀-100 ₃ commonly share the high current indication signal HC#via high current indication signal node 424. The high current indicationsignal node 424 is selectively connected to a voltage supply node 836,coupled to receive a supply voltage such as Vcc, through a resistor 838and a switch, e.g., transistor 837, each transistor 837 having a controlgate coupled to receive a control signal. The resistor 838, transistor837 and voltage supply node 836 may be collectively referred to as aweak pull-up driver, or simply pull-up driver. Die 100 ₀ may have thecontrol gate of its transistor 837 coupled to receive the control signalPuenb_die0, die 100 ₁ may have the control gate of its transistor 837coupled to receive the control signal Puenb_die1, die 100 ₂ may have thecontrol gate of its transistor 837 coupled to receive the control signalPuenb_die2, and die 100 ₃ may have the control gate of its transistor837 coupled to receive the control signal Puenb_die3. These controlsignals are generated to deactivate their respective transistor 837unless they are designated to pull up the high current indication signalHC#. For example, where die 100 ₀ is designated to normally pull thehigh current indication signal HC# high, its control signal Puenb_die0might be normally low to activate its respective p-type field-effecttransistor (p-FET) 837, while the control signals Puenb_die1, Puenb_die2and Puenb_die3 might be normally high to deactivate their respectivetransistors 837.

For each of the dies 100 ₀-100 ₃, another voltage supply node, such asreference potential node 834, coupled to receive a reference potentialsuch as a ground or Vss, may be selectively connected to the highcurrent indication signal node 424 through a switch, e.g., a transistor832, each having a control gate coupled to receive a control signal. Forexample, die 100 ₀ may have the control gate of its transistor 832coupled to receive the control signal G0, die 100 ₁ may have the controlgate of its transistor 832 coupled to receive the control signal G1, die100 ₂ may have the control gate of its transistor 832 coupled to receivethe control signal G2, and die 100 ₃ may have the control gate of itstransistor 832 coupled to receive the control signal G3. These controlsignals are generated (e.g., by the internal controllers of the dies) toactivate their respective transistor 832 responsive to their respectivedie 100 experiencing a high current demand portion of an accessoperation, e.g., in response to a value of the wrap-around countermatching a counter value assigned to that die 100 and the total unitconsumption determined by that die 100 being less than or equal to theunit limit while an access operation of that die 100 is paused at one ofits designated points. As an example, the control signals for the gatesof transistors 832 may be normally logic low to deactivate the depictedn-type field-effect transistor (n-FET), and may transition to a logichigh responsive to a die 100 experiencing a period of high currentdemand. These control signals may be held at a logic high for one ormore secondary clock cycles of the internal clock signal ICLK to providean indication of high current demand for their respective dies 100. Assuch, when a transistor 832 is activated, the voltage level of the highcurrent indication signal node 424 will be pulled to a logic low, andthe voltage level of the high current indication signal node 424 will bepulled back to a logic high when none of the transistors 832 areactivated.

FIG. 9 is a simplified schematic of a circuit for generating theready/busy control signal RB# for the type of multi-die packagesdepicted in FIG. 4a or 4 b, e.g., whether or not the ready/busy controlsignal node can be connected to an available pull-up resistor, accordingto an embodiment. As depicted in FIG. 9, four dies 100 ₀-100 ₃ commonlyshare the ready/busy control signal RB# via ready/busy control signalnode 426. The ready/busy control signal node 426 can be connected to anexternal pull-up resistor, i.e., voltage supply node 418 coupled toreceive a supply voltage such as Vcc, and resistor 420. In addition orin the alternative, for each die 100 sharing the ready/busy controlsignal node 426, the ready/busy control signal node 426 may beselectively connected to a voltage supply node 918, coupled to receive asupply voltage such as Vcc, through a resistor 920 and a switch, e.g.,transistor 919. The resistor 920, transistor 919 and voltage supply node918 may be collectively referred to as a weak pull-up driver, or simplypull-up driver. Each transistor 919 may have its control gate coupled toreceive a control signal. Die 100 ₀ may have the control gate of itstransistor 919 coupled to receive the control signal RB_PU0#, die 100 ₁may have the control gate of its transistor 919 coupled to receive thecontrol signal RB_PU1#, die 100 ₂ may have the control gate of itstransistor 919 coupled to receive the control signal RB_PU2#, and die100 ₃ may have the control gate of its transistor 919 coupled to receivethe control signal RB_PU3#. These control signals are generated todeactivate their respective transistor 919 unless they are designated topull up the ready/busy control signal RB#, such as in the case where nopull-up transistor (e.g., voltage supply node 418 and resistor 420) isavailable external to the dies 100. For example, where die 100 ₀ isdesignated to normally pull the ready/busy control signal RB# high, itscontrol signal RB_PU0# might be normally low to activate its respectivep-type field-effect transistor (p-FET) 919, while the control signalsRB_PU1#, RB_PU2# and RB_PU3# might be normally high to deactivate theirrespective transistors 919. In cases where a pull-up transistor isavailable to the ready/busy control signal node 426 external to the dies100, each of the transistors 919 might be deactivated.

For each of the dies 100 ₀-100 ₃, another voltage supply node, such asreference potential node 935, coupled to receive a reference potentialsuch as a ground or Vss, may be selectively connected to the ready/busycontrol signal node 426 through a switch, e.g., a transistor 933, eachhaving a control gate coupled to receive a control signal. For example,die 100 ₀ may have the control gate of its transistor 933 coupled toreceive the control signal RBen0, die 100 ₁ may have the control gate ofits transistor 933 coupled to receive the control signal RBen1, die 100₂ may have the control gate of its transistor 933 coupled to receive thecontrol signal RBen2, and die 100 ₃ may have the control gate of itstransistor 933 coupled to receive the control signal RBen3. Thesecontrol signals are generated to activate their respective transistor933 when their respective die 100 is busy, e.g., during periods of anaccess operation. As an example, the control signals for the gates oftransistors 933 may be normally logic low to deactivate the depictedn-FET, and may transition to a logic high when an access operation isinitiated, and may return to a logic low when the access operation iscompleted. As such, when a transistor 933 is activated, the voltagelevel of the ready/busy control signal node 426 will be pulled to alogic low, and the voltage level of the ready/busy control signal node426 will be pulled back to a logic high when none of the transistors 933are activated. For some embodiments, the die 100 designated to normallypull the ready/busy control signal RB# high may disable its pull-updriver when any of the dies 100 sharing the ready/busy control signalRB# is in a period of high current demand, e.g., when any of the controlsignals RBen0-RBen3 of FIG. 17 have a logic level to activate theirrespective transistors 933. To avoid the ready/busy control signal RB#floating before one of the transistors 919 is activated, each transistor919 of a die 100 sharing the ready/busy control signal RB# may beactivated during power-up of the dies 100, then deactivated aftercompletion of the power-up routine. During this period, the transistors933 of these dies 100 remain deactivated.

FIG. 10a is a simplified schematic of a circuit for generating theinternal clock signal ICLK and the count of the wrap-around counteraccording to an embodiment. As depicted in FIG. 10a , four dies 100₀-100 ₃ commonly share the clock signal ICLK via clock signal node 422.Each die 100 is depicted to include a clock counter (e.g., wrap-aroundcounter) 1036, a clock generator 1038, an output buffer 1040 and aninput buffer 1042. The output buffer 1040 (e.g., a clock output) has itsoutput connected to the clock signal node 422, while the input buffer1042 has its input connected to the clock signal node 422. The boldedsections denote portions of the circuits that may be active for each ofthe respective dies 100 ₀-100 ₃ while the ready/busy control signal RB#is logic low, for some embodiments even if any of the dies 100 ₀-100 ₃is in standby mode. For the example of FIG. 10a , die 100 ₀ isdesignated for providing (e.g., generating) the clock signal ICLK, whilethe clock generators 1038 for the remaining dies 100 are inactive.

Each of the wrap-around counters 1036 is connected to receive a clocksignal ICLK either directly from its corresponding clock generator 1038,such as in the case of die 100 ₀, or from its input buffer 1042, such asin the case of dies 100 ₁-100 ₃. In this manner, each of the wrap-aroundcounters 1036 may remain synched as each is operating from the sameclock signal ICLK, i.e., the clock signal ICLK generated by the clockgenerator 1038 of die 100 ₀.

FIG. 10b is a simplified schematic of a circuit for generating theinternal clock signal ICLK and the count of the wrap-around countershowing an example of using the ready/busy control signal RB# to enablethe clock generator according to an embodiment. As depicted in FIG. 10b, four dies 100 ₀-100 ₃ commonly share the clock signal ICLK via clocksignal node 422. Each die 100 is depicted to include a clock counter(i.e., wrap-around counter) 1036, a clock generator 1038, an outputbuffer 1040 and an input buffer 1042. The output buffer 1040 has itsoutput connected to the clock signal node 422, while the input buffer1042 has its input connected to the clock signal node 422. Each die 100is further depicted to include an input buffer 1041 having its inputconnected to the ready/busy control signal node 426 and its outputconnected to the clock generator 1038. The clock generator 1038 mayutilize the output of the buffer 1041 as an enable signal, i.e.,generating the clock signal ICLK if the output of the buffer 1041 has afirst logic level, such as logic low, and stopping generation of theclock signal ICLK if the output of the buffer 1041 has a second logiclevel, such as logic high. Although not shown in FIG. 10b , the outputof the buffer 1041 might be connected to the wrap-around counter 1036 toreset the value of the wrap-around counter 1036 (e.g., reset to zero),when the output of the buffer 1041, and thus the ready/busy controlsignal RB#, is a logic high.

The bolded sections of FIG. 10b denote portions of the circuits that maybe active for each of the respective dies 100 ₀-100 ₃ while theready/busy control signal RB# is logic low, for some embodiments even ifany of the dies 100 ₀-100 ₃ is in standby mode. For the example of FIG.10b , die 100 ₀ is designated for generating the clock signal ICLK,while the clock generators 1038 for the remaining dies 100 are inactive.Each of the wrap-around counters 1036 is connected to receive a clocksignal ICLK either directly from its corresponding clock generator 1038,such as in the case of die 100 ₀, or from its input buffer 1042, such asin the case of dies 100 ₁-100 ₃. In this manner, each of the wrap-aroundcounters 1036 may remain synched as each is operating from the sameclock signal ICLK, i.e., the clock signal ICLK generated by the clockgenerator 1038 of die 100 ₀.

FIG. 11 is a schematic representation of a multi-die package includingeight dies 100 (e.g., 100 ₀-100 ₇) according to an embodiment. The clocksignal ICLK is commonly shared between the dies 100 through a clocksignal node 422. Dies 100 ₀-100 ₇ might be part of a package 302. Dies100 ₀-100 ₃ might be selectively enabled in response to a chip enablesignal CE0# through chip-enable signal node 432 a. Dies 100 ₄-100 ₇might be selectively enabled in response to a chip enable signal CE1#through chip-enable signal node 432 b.

One of the dies 100 ₀-100 ₃ might be designated to provide the clocksignal ICLK, e.g., in response to the ready/busy control signal RB#, andone of the dies 100 ₄-100 ₇ might also be designated to provide theclock signal ICLK, e.g., in response to the ready/busy control signalRB#. The high current indication signal HC# is commonly shared betweenthe dies 100 through a high current indication signal node 424. The highcurrent indication signal HC# may be normally pulled to a particularstate (e.g., pulled high). The ready/busy control signal RB# is commonlyshared between the dies 100 through a ready/busy control signal node426. The ready/busy control signal RB# may be normally pulled to aparticular state (e.g., pulled high). Each of the dies 100 is furthercommonly connected to a control link 132 and to an I/O bus 134. For suchan example, wrap-around counters for each of the dies 100 might countfrom 0 to 7, even though some of the dies 100 might be disabled fromaccepting commands in response to their respective chip enable signal.It is noted that even when a die 100 is disabled from acceptingcommands, it may still perform power management according to variousembodiments, such as while performing an access operation in response toa command received before its chip enable signal was transitioned high.

FIG. 12 is a schematic representation of a multi-die package includingeight dies 100 (e.g., 100 ₀-100 ₇) according to another embodiment. Theclock signal ICLK is commonly shared between the dies 100 through aclock signal node 422. Dies 100 ₀-100 ₇ might be part of a package 302.Dies 100 ₀-100 ₃ might be selectively enabled in response to a chipenable signal CE0# through chip-enable signal node 432 a. Dies 100 ₄-100₇ might be selectively enabled in response to a chip enable signal CE1#through chip-enable signal node 432 b.

One of the dies 100 ₀-100 ₃ might be designated to provide the clocksignal ICLK, e.g., in response to a ready/busy control signal RB0#, andone of the dies 100 ₄-100 ₇ might also be designated to provide theclock signal ICLK, e.g., in response to a ready/busy control signal RB#.The high current indication signal HC# is commonly shared between thedies 100 through a high current indication signal node 424. The highcurrent indication signal HC# may be normally pulled to a particularstate (e.g., pulled high). The ready/busy control signal RB0# iscommonly shared between the dies 100 ₀-100 ₃ through a ready/busycontrol signal node 426 a. The ready/busy control signal RB1# iscommonly shared between the dies 100 ₄-100 ₇ through a ready/busycontrol signal node 426 b. The ready/busy control signals RB0# and RB1#may be normally pulled to a particular state (e.g., pulled high). Eachof the dies 100 is further commonly connected to a control link 132 andto an I/O bus 134. For such an example, wrap-around counters for each ofthe dies 100 might count from 0 to 7, even though some of the dies 100might be disabled from accepting commands in response to theirrespective chip enable signal. It is noted that even when a die 100 isdisabled from accepting commands, it may still perform power managementaccording to various embodiments, such as while performing an accessoperation in response to a command received before its chip enablesignal was transitioned high.

For the multi-die packages of FIGS. 11 and 12, it may be desired thatonly one die 100 provide (e.g., generate) the internal clock signal ICLKat any given time. For example, where die 100 ₀ and die 100 ₄ aredesignated as the default dies for providing the internal clock signalICLK, it might be desirable if only one of those dies were to providethe internal clock signal ICLK if both ready/busy control signals RB0#and RB1# were transitioned low. As such, each die 100 designated toprovide the internal clock signal ICLK might first determine whether theinternal clock signal ICLK is already active prior to providing its ownclock signal.

As two dies 100 designated to provide the internal clock signal ICLKmight seek to provide their clock signals simultaneously, each such die100 might be assigned a different delay before starting its own clockgenerator. For the foregoing example, die 100 ₀ might wait for X clockcycles of a system clock before starting its own clock generator and die100 ₄ might wait for Y clock cycles of the system clock before startingits own clock generator, where X and Y are different integer values. Thedifference between X and Y might be such that if one die starts itsclock generator, the other die has sufficient time to detect activity ofthe internal clock signal ICLK before its delay is reached. The delaysmay each be longer than one cycle of the internal clock signal ICLK toallow for detection. To further mitigate the situation where two diesseek to generate the internal clock signal ICLK simultaneously, each diegenerating the internal clock signal ICLK might be configured to stopits clock generator if an improper frequency of the internal clocksignal ICLK is detected (e.g., a frequency that is too high), andreinitiate their respective delays and check for activity beforerestarting their clock generators.

While multiple dies might be designated to provide the internal clocksignal ICLK in some embodiments, other embodiments may designate onlyone die to provide the internal clock signal ICLK. FIG. 13 is a timingdiagram showing conceptually how only a particular die 100, such as oneof the dies 100 ₀-100 ₇ of FIG. 11 or 12, might be designated to providethe clock signal ICLK according to an embodiment. For example, uponapplication of power (e.g., Vcc), each of the chip enable signals CE0#and CE1# might be transitioned low, to enable the dies 100 to receivecommands and parameters. An initialization command (e.g., FFh) might beprovided to begin an initialization routine on each of the dies 100.After the initialization routines are complete, the chip enable signalCE0# of a subset of the dies 100, e.g., dies 100 ₀-100 ₃, might again betransitioned low while the remaining chip enable signal CE1# of adifferent subset of the dies 100, e.g., dies 100 ₄-100 ₇, might remainhigh, thereby enabling dies 100 ₀-100 ₃ to receive commands andparameters without affecting dies 100 ₄-100 ₇. Subsequently, a setfeature command (EFh), a feature address (FA) and one or more parameters(e.g., P1-P4) might indicate to a particular die 100 designated by thefeature address, e.g., die 100 ₀, that it is to provide the internalclock signal ICLK, and activate the corresponding circuitry to do so(e.g., activate the bolded circuitry of die 100 ₀ of FIG. 10a or 10 b).Remaining dies 100, e.g., dies 100 ₁-100 ₇, might default to not providea clock signal, but instead activate the corresponding circuitry toreceive the internal clock signal ICLK from the clock signal node 422(e.g., activate the bolded circuitry of dies 100 ₁-100 ₃ of FIG. 10a or10 b).

Fewer or more parameter values might be used, depending upon the levelof detail of parameter options to pass to the dies 100. For one example,parameter options might include whether to enable or disable peak powermanagement (PPM), what number of dies share the internal clock signalICLK (e.g., logical unit numbers or LUNs), whether the ready/busy signalis to be pulled up internal to the device or by an external pull-updriver, what access operations are subject to power management, whatvalue to assign the unit limit, whether to enable or disable the clockgenerator, what mapping to use for the addressed die (e.g., what countervalue to assign), and whether mapping is enabled (e.g., might bedisabled after first mapping is set). Tables 1 and 2 show example valuesfor these parameter options that might be provided to the diecorresponding to the feature address of the set feature command duringfirst and second parameter data cycles, respectively.

TABLE 1 Parameter Option Values—First Data Cycle Enable/Disable PPMDisable PM 0 Enable PM 1 Number of LUNs 2 0 0 4 0 1 8 1 0 16 1 1 RBPull-Up External 0 Internal 1 PM Access Operations Write Op 0 Write and1 Erase Ops Unit Limit 1 0 0 X 2 0 1 0 3 0 1 1 4 1 0 0 5 1 0 1 6 1 1 0 71 1 1

TABLE 2 Parameter Option Values—Second Data Cycle Enable/Disable ClockDisable 0 Enable 1 LUN Mapping 0000 0 0 0 0 0001 0 0 0 1 0010 0 0 1 00011 0 0 1 1 0100 0 1 0 0 0101 0 1 0 1 0110 0 1 1 0 0111 0 1 1 1 1000 10 0 0 1001 1 0 0 1 1010 1 0 1 0 1011 1 0 1 1 1100 1 1 0 0 1101 1 1 0 11110 1 1 1 0 1111 1 1 1 1 Enable Mapping Disable 0 Enable 1

Although the foregoing example showed conceptually how one die might bedesignated to provide the internal clock signal ICLK, a similar processcould also be used to designate more than one die to provide theinternal clock signal ICLK. Furthermore, a command could be provided tostart and/or stop the clock generator of a particular die, regardless ofa value of a ready/busy control signal. Such a command might be used toprovide the internal clock signal ICLK on a designated die before anyarray operations are requested. For example, if it is desired to use die100 ₀ of FIG. 12 to provide the internal clock signal ICLK for dies 100₀-100 ₇, RB0# might not yet have transitioned low if no die 100 ₀-100 ₃is busy, but one or more of the dies 100 ₄-100 ₇ might be busy. Thus, itmay be desirable to start the clock generator on die 100 ₀, in order forthe dies 100 ₀-100 ₇ to participate in power management, regardless ofthe value of the ready/busy signal RB0#.

FIG. 14 is a simplified block diagram of a of an electronic systemhaving multiple channels according to another embodiment. Some systemsmay utilize multiple channels to communicate with multiple dies 100, toimprove performance, for example. FIG. 14 depicts a system having fourchannels 1490 (i.e., channels 1490 ₀, 1490 ₁, 1490 ₂ and 1490 ₃). Feweror more channels 1490 are possible. Each channel 1490 is depicted toinclude N dies 100. While each channel 1490 is depicted to include thesame number of dies 100, each channel 1490 could have differing numbersof dies 100, for example. The channels 1490 may represent communicationschannels between the dies 100 and an external controller 1430. Forexample, each channel 1490 may include a control link 132 and I/O bus134 as discussed with reference to FIG. 1. For embodiments utilizingmultiple channels, the system may vary the unit limit for each channel,and may disable peak power management for one or more of the channels aswell. For example, channel 1490 ₃ may be coupled to one or more dies 100for storage of archival data, such that performance might be deemed alow priority. In this case, the system (e.g., controller 1430) couldassign a low unit limit (e.g., allowing only one die 100 coupled tochannel 1490 ₃ to experience a period of high current demand at onetime) to the dies 100 coupled to channel 1490 ₃. In contrast, the systemmay disable peak power management entirely for the dies 100 coupled tochannel 1490 ₀ if access speed is deemed to be more critical than powermanagement for those dies 100. Furthermore, the system might assignother unit limits to the dies 100 coupled to channels 1490 ₁ and 1490 ₂to maintain its overall power budget.

FIG. 15 is a flowchart of a method of operating a plurality of diesaccording to an embodiment. At 1540, a clock signal is generated in aparticular die of the plurality of dies. The plurality of dies commonlyshare the clock signal, e.g., the internal clock signal ICLK. At 1541,cycles (e.g., primary cycles) of the clock signal are counted in acounter (e.g., a wrap-around counter) in each die of the plurality ofdies. Each die of the plurality of dies has an assigned counter value.For example, in a multi-die package containing N dies, counter values of0 through N−1 might be assigned, one value to each die withoutrepetition. As such, a wrap-around counter might count from a firstvalue, e.g., 0, to a last value, e.g., N−1, and then return to the firstvalue on the next clock signal. At 1542, the particular die monitors anindication of high current demand (e.g., to determine a unit consumptionof current for each value of the counter) and determines a total unitconsumption. At 1543, an access operation for the particular die of theplurality of dies is paused at a designated point until a value of thecounter matches the assigned counter value of the particular die.

When the count value of the counter matches the assigned counter valueof the particular die, the particular die compares total unitconsumption, as determined by the particular die, to a unit limit at1544. If the unit limit is exceeded at 1545, the method proceeds to 1546and resets the total unit consumption value determined by the particulardie. The method then returns to 1542 to monitor an indication of highcurrent demand and determine a total unit consumption. If the unit limitis not exceeded at 1545, i.e., the total unit consumption is less thanor equal to the unit limit, the method proceeds to 1547 and resumes theaccess operation of the particular die and provides an indication ofhigh current demand (e.g., an indication that the particular die isexperiencing a high current demand portion of an operation) to remainingdies of the plurality of dies. The method then proceeds to 1546 andresets the value of the total unit consumption determined by theparticular die. Although FIG. 15 depicts a particular order in thisexample, some acts could be performed concurrently or in a differentorder. For example, resetting of the value of the total unit consumptiondetermined by the particular die at 1546 could alternatively beperformed before resuming the access operation at 1547 or concurrentlywith resuming the access operation at 1547.

FIG. 16 is a schematic of a wrap-around counter according to anembodiment. The wrap-around counter includes a clock divider 1658coupled to receive the internal clock signal ICLK at its input and toprovide a divided internal clock signal ICLKd at its output. The clockdivider 1658 is configured to provide the divided internal clock signalICLKd to have one clock cycle for each primary clock cycle of theinternal clock signal ICLK. In this manner, the wrap-around counter mayprovide a count corresponding to each primary clock cycle of theinternal clock signal ICLK while ignoring secondary clock cycles of theinternal clock signal ICLK.

The wrap-around counter includes an XOR gate 1650 having its outputcoupled to the control input (e.g., d input) of a D flip-flop 1652, afirst input coupled to a supply node 1662 to receive a supply voltage,e.g., Vcc, and a second input coupled to the output (e.g., a normaloutput or q output) of the D flip-flop 1652. The D flip-flop 1652 mightbe a rising edge triggered D flip-flop, for example. The inverted outputor q-bar output of the D flip-flop 1652 may be unused. The D flip-flop1652 has its clock input coupled to receive the divided internal clocksignal ICLKd, and is further coupled to receive a RESET signal. TheRESET signal may represent the ready/busy control signal RB#. Thewrap-around counter further includes a NAND gate 1658 having a firstinput coupled to the first input of the XOR gate 1650, a second inputcoupled to the second input of the XOR gate 1650, and an output coupledto the input of an inverter 1660. The wrap-around counter furtherincludes an XOR gate 1654 having its output coupled to the control input(e.g., d input) of a D flip-flop 1656, a first input coupled to theoutput (e.g., normal output or q output) of the D flip-flop 1656, and asecond input coupled to the output of the inverter 1660. The D flip-flop1656 might be a rising edge triggered D flip-flop, for example. Theinverted output or q-bar output of the D flip-flop 1652 may be unused.The D flip-flop 1656 has its clock input coupled to receive the dividedinternal clock signal ICLKd, and is further coupled to receive the RESETsignal. The output of the D flip-flop 1652 represents the signal q<0>while the output of the D flip-flop 1656 represents the signal q<1>.

The wrap-around counter of FIG. 16 represents a 2-bit wrap-aroundcounter, providing values of 0 to 3, for example. The signals q<0> andq<1> of the wrap-around counter may be combined to generate signalsrepresentative of the value of the wrap-around counter. For example, thewrap-around counter may further include an inverter 1672 providing acount0 signal at its output, and having its input coupled to the outputof a NAND gate 1664. The NAND gate 1664 has a first input coupled to theoutput of an inverter 1680, and a second input coupled to the output ofan inverter 1682. The inverter 1680 has its input coupled to receive theq<0> signal, while the inverter 1682 has its input coupled to receivethe q<1> signal. The count0 signal may represent a counter value of 0when it has a particular logic level, e.g., a logic high. Thewrap-around counter may further include an inverter 1674 providing acount1 signal at its output, and having its input coupled to the outputof a NAND gate 1666. The NAND gate 1666 has a first input coupled toreceive the q<0> signal, and a second input coupled to the output of aninverter 1684. The inverter 1684 has its input coupled to receive theq<1> signal. The count1 signal may represent a counter value of 1 whenit has a particular logic level, e.g., a logic high. The wrap-aroundcounter may further include an inverter 1676 providing a count2 signalat its output, and having its input coupled to the output of a NAND gate1668. The NAND gate 1668 has a first input coupled to the output of aninverter 1686, and a second input coupled to receive the q<1> signal.The inverter 1686 has its input coupled to receive the q<0> signal. Thecount2 signal may represent a counter value of 2 when it has aparticular logic level, e.g., a logic high. The wrap-around counter mayfurther include an inverter 1678 providing a count3 signal at itsoutput, and having its input coupled to the output of a NAND gate 1670.The NAND gate 1670 has a first input coupled to receive the q<0> signal,and a second input coupled to receive the q<1> signal. The count3 signalmay represent a counter value of 3 when it has a particular logic level,e.g., a logic high.

FIG. 17 depicts waveforms for the wrap-around counter of FIG. 16. Forthe example wrap-around counter of FIG. 16, the signals q<0> and q<1>are held to logic low if the RESET signal is asserted, e.g., has a logichigh level. In addition, the signals q<0> and q<1> will not transitionuntil the internal clock signal ICLK is enabled while the RESET signalis deasserted, e.g., has a logic low level. As can be seen in FIG. 17,the signals count0, count1, count2 and count3 are successivelytransitioned to logic high for one period of the divided internal clocksignal ICLKd. While the divided internal clock signal ICLKd has, in thisexample, one-half the frequency of the internal clock signal ICLK (e.g.,using a 2:1 clock divider), other divisions are possible. For example,where the internal clock signal ICLK has one primary clock cycle toevery three secondary clock cycles, the internal clock signal ICLK couldbe provided to a 4:1 clock divider to produce the appropriate dividedinternal clock signal ICLKd to generate one count of the wrap-aroundcounter for each primary clock cycle of the internal clock signal ICLK.

When the last count signal, e.g., signal count3 is transitioned logiclow, the wrap-around counter returns to transition the signal count0 tologic high to repeat the cycle while the internal clock signal ICLK isenabled. Thus, for an embodiment using four dies, each die could look toa respective count signal of the wrap-around counter of FIG. 16 todetermine when the wrap-around counter value matches a counter valueassigned to that die. For example, a die assigned a counter value of 0could deem the counter value to be 0 when the signal count0 has a logichigh level, a die assigned a counter value of 1 could deem the countervalue to be 1 when the signal count1 has a logic high level, a dieassigned a counter value of 2 could deem the counter value to be 2 whenthe signal count2 has a logic high level, and a die assigned a countervalue of 3 could deem the counter value to be 3 when the signal count3has a logic high level.

While the wrap-around counter of FIG. 16 depicted an example forgenerating counter values of 0 to 3 (e.g., a 2-bit counter), wrap-aroundcounters having different counter values may be designed by those ofordinary skill in the art. For example, a wrap-around counter forgenerating counter values of 0 to 1 (e.g., a 1-bit counter) might beobtained using a single D flip-flop, where a counter value of 0 mightcorrespond to a normal output having a logic high level, and a countervalue of 1 might correspond to an inverted output having a logic highlevel. In addition, a wrap-around counter for generating counter valuesof 0 to 7 (e.g., a 3-bit counter) might be obtained by repeating thecircuitry for generating signals q<0> and q<1>, but providing signalq<0> to the clock inputs of the two D flip-flops to generate signalsq<2> and q<3> (not shown) at the outputs of the two additional Dflip-flops. The resulting signals q<0>, q<1>, q<2> and q<3> could thenbe logically combined to generate eight count signals, each successivelytransitioning to a logic high level for one period of the dividedinternal clock signal ICLKd. Similarly, logic levels representative ofparticular states or counter values can be altered as desired usingappropriate combinatorial logic.

CONCLUSION

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement that is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. Many adaptations ofthe embodiments will be apparent to those of ordinary skill in the art.For example, while operation might have been described as being enabledor activated in response to a first logic level, and disabled ordeactivated in response to a second logic level, it would be astraightforward task to alter the logic to enable/activate in responseto the second logic level, and disable/deactivate in response to thefirst logic level. Similarly, while the discussion referred to voltagesupply nodes and reference potential nodes as corresponding to high andlow voltages, respectively, these conventions could also be reversed.Accordingly, this application is intended to cover any adaptations orvariations of the embodiments.

What is claimed is:
 1. An apparatus, comprising: an array of memorycells; a controller to perform access operations on the array of memorycells; a clock signal node; a clock generator; and a counter having aninput connected to selectively receive a signal from the clock signalnode and from an output of the clock generator.
 2. The apparatus ofclaim 1, wherein the input of the counter is connected to receive asignal from the clock signal node when an input buffer between the clocksignal node and the input of the counter is activated, and to receive asignal from the output of the clock generator when the clock generatoris activated.
 3. The apparatus of claim 2, wherein, when the clockgenerator is activated, the clock signal node is connected to receive asignal from the clock generator when an output buffer between the clocksignal node and the clock generator is activated.
 4. The apparatus ofclaim 1, wherein the controller is configured to resume a paused accessoperation in response to, at least in part, a value of the counter. 5.The apparatus of claim 1, wherein the clock signal node is configuredfor connection to an external device.
 6. The apparatus of claim 1,wherein the apparatus is a first apparatus, and wherein the clock signalnode of the first apparatus is connected to a clock signal node of asecond apparatus, the second apparatus further comprising: an array ofmemory cells; a controller to perform access operations on the array ofmemory cells of the second apparatus; a clock generator; and a counterhaving an input connected to selectively receive a signal from the clocksignal node of the second apparatus and from an output of the clockgenerator of the second apparatus.
 7. An apparatus, comprising: an arrayof memory cells; a controller to perform access operations on the arrayof memory cells; a clock signal node; a counter; a clock generator; andan input buffer connected between the clock signal node and the counter;an output buffer connected between the clock generator and the clocksignal node; wherein the counter is connected to receive a signal fromthe clock signal node when the input buffer is activated, and to receivea signal from the clock generator when the clock generator is activated;wherein the controller is configured to activate the output buffer andto deactivate the input buffer when the clock generator is activated;and wherein the controller is further configured to activate the inputbuffer and to deactivate the output buffer when the clock generator isdeactivated.
 8. The apparatus of claim 7, wherein a signal received bythe clock signal node from the clock generator when the output buffer isactivated and the clock generator is activated, and the signal receivedby the counter from the clock generator when the clock generator isactivated, are a same clock signal.
 9. The apparatus of claim 7, whereinthe counter comprises a clock divider and wherein the clock divider isconnected to receive the signal from the clock signal node when theinput buffer is activated, and to receive the signal from the clockgenerator when the clock generator is activated.
 10. The apparatus ofclaim 7, further comprising: a second signal node; wherein the signalreceived by the counter from the clock signal node or the clockgenerator is an input clock signal; wherein the counter is configured tocount one cycle of every N cycles of the input clock signal, with Nhaving an integer value greater than or equal to two; and wherein thecontroller is further configured to determine when the second signalnode has a particular logic level during remaining cycles of the Ncycles of the input clock signal for each of at least one value of thecounter.
 11. The apparatus of claim 10, wherein the at least one valueof the counter comprises each value of the counter other than aparticular value of the counter.
 12. The apparatus of claim 10, whereinthe controller is further configured to determine whether to resume apaused access operation in response to at least a number of cycles ofthe input clock signal for which the second signal node was determinedto have the particular logic level.
 13. The apparatus of claim 10,wherein the counter is a wrap-around counter having M possible valueswith M having an integer value greater than or equal to two, wherein thecontroller is further configured to count a number of the remainingcycles of the N cycles of the input clock signal when the second signalnode has the particular logic level for each of the at least one valueof the counter, and wherein the controller is further configured togenerate a tallied value responsive to at least the count for each ofthe at least one value of the counter for a cycle of the M possiblevalues of the counter.
 14. The apparatus of claim 13, wherein thecontroller is configured to generate the tallied value furtherresponsive to the value of the counter for each of the respectivecounts.
 15. The apparatus of claim 14, wherein each of the at least onevalue of the counter is associated with a respective multiplier, andwherein the controller is configured to generate the tallied valueresponsive to the count for each of the at least one value of thecounter for the cycle of the M possible values of the counter times therespective multiplier associated with each of the at least one value ofthe counter for the cycle of the M possible values of the counter. 16.An apparatus, comprising: a plurality of memory devices, each memorydevice of the plurality of memory devices comprising: an array of memorycells; a controller to perform access operations on the array of memorycells; a clock signal node; a second signal node; a counter; and a clockgenerator; wherein the counter is connected to receive a clock signalfrom the clock signal node or from the clock generator; wherein thecontroller is configured to determine when the second signal node has aparticular logic level, to pause one or more of the access operations atdesignated points, and to resume a paused access operation of the one ormore of the access operations in response to, at least in part, a valueof the counter and a number of cycles of the received clock signal whenthe second signal node was determined to have the particular logiclevel; wherein the clock signal nodes of the plurality of memory devicesare commonly connected; and wherein the second signal nodes of theplurality of memory devices are commonly connected.
 17. The apparatus ofclaim 16, wherein, for at least one memory device of the plurality ofmemory devices, its counter is connected to receive the clock signalfrom its clock signal node when an input buffer between its counter andits clock signal node is activated, and to receive the clock signal fromits clock generator when its clock generator is activated.
 18. Theapparatus of claim 17, wherein, for at least one memory device of theplurality of memory devices, when its clock generator is activated, itsclock signal node is connected to receive the clock signal from itsclock generator when an output buffer between its clock signal node andits clock generator is activated.
 19. The apparatus of claim 16,wherein, for at least one memory device of the plurality of memorydevices, its controller is further configured to determine whether aclock signal is active on its clock signal node, and to activate itsclock generator if a clock signal is determined not to be active. 20.The apparatus of claim 16, wherein the respective controller for eachmemory device of the plurality of memory devices is configured to causeits second signal node to pull to the particular logic state when thatmemory device is resuming an access operation of the one or more of theaccess operations paused at a designated point of that paused accessoperation.
 21. The apparatus of claim 16, wherein, for each memorydevice of the plurality of memory devices, its counter is furtherconfigured to divide its received clock signal, and to count cycles ofthe divided clock signal.